This position was with HCS, process followed 1. Screening process from HR, skills, salary requirements 2. 1st round tech discussion from team 3. 2nd tech discussion from one more team member 4. Director round. They did not agreed for the compensation, which was initially discussed, so I declined it.
Fragen im Vorstellungsgespräch [1]
Frage 1
1. C++ questions 2. Multithreading producer consumer 3. Automotive and infotaiment discussions 4. projects discussion
Vorstellungsgespräch absolviert bei HARMAN (Bengaluru)
Vorstellungsgespräch
Hr screening round for background and some info about Harman
Tech round 1 - interview mostly around the embedded device
Tech round 2- same but different interviewer
Tech round 3- a coding puzzle and background
Tech round 4- more related to work this position was for and relevant tech knowledge
Fragen im Vorstellungsgespräch [1]
Frage 1
Embedded systems international and low level os details
Went well. Mostly asked about relevant questions. 4 rounds of different skills evaluated. Got the link in linked in. Asked about our previous projects and challenges which we experienced before
